SUNLU High Speed PLA+ 2.0

Name: SUNLU High Speed PLA+ 2.0
Brand: SUNLU

Specifications

Nozzle temperature200–260 °C

Bed temperature55–65 °C

Print speed300–600 mm/s

Density1.24 g/cm³

Description

SUNLU High Speed PLA+ 2.0 is a high-speed filament built to print at up to 600 mm/s without sacrificing quality. The key difference from regular PLA is its optimized melt flow and higher impact resistance — SUNLU rates it at 10x the toughness of standard PLA, with a tight ±0.02 mm diameter tolerance. It's a solid pick for rapid prototyping, batch production, and functional parts.

Print Settings

Nozzle temperature: 200–260 °C (speed-tiered: 200–215 °C for 50–150 mm/s, 215–230 °C for 150–300 mm/s, 230–260 °C for 300–600 mm/s)
Bed temperature: 55–65 °C, no adhesive needed
Print speed: up to 600 mm/s, recommended working speed around 300 mm/s
Neatly wound spool and consistent flow — no tangles or feed skips
Low-warp formula: prints reliably with or without an enclosure

This is a high-speed filament: to actually print faster you need a printer with a capable extruder and part cooling (e.g. fast bedslingers and CoreXY machines rated for 250+ mm/s). On a slow printer it behaves like regular PLA+ but without the speed gain.

This line is aimed at makers who want both speed and strength: prototypes, small-batch runs, tools, enclosures, and cosplay props. It works with any 1.75 mm FDM printer — from SUNLU machines to third-party brands.